Department of Defense STEM Advocate of the Quarter Award to Dr. John DiCecco from the Naval Undersea Warfare Center Division Newport, during the 2018 Engineers Week flexible silicon-on-polymer chip Reliance 21 DoD Communities of Interest Poster (2018)

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A collaboration between the Air Force Research Laboratory and American Semiconductor has produced a flexible silicon-on-polymer chip with more than 7,000 times the memory capability of any current flexible integrated circuit on the market today. The manufacturing takes advantage of flexible hybrid electronics, integrating traditional manufacturing techniques with 3D electronic printing to create thin, flexible semiconductors that can augment efforts in wearable technology, asset monitoring, logistics and more.

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